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Multichip module design, fabrication, and testing
- 作者： Licari, James J 1930-
- 其他題名：
- Electronic packaging and interconnection series
- 出版： New York : McGraw-Hill
- 叢書名： Electronic packaging and interconnection series
- 主題： Electronic packaging , Multichip modules (Microelectronics)--Design and construction , Multichip modules (Microelectronics)--Testing
- ISBN： 0070377154 :: US$55.00
- 資料類型: 圖書
- 內容註: Includes bibliographical references and index
-
讀者標籤：
- 系統號： 005140279 | 機讀編目格式
館藏資訊
The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested and manufactured. This evolving technology for packaging printed circuit boards (PCBs) is commanding both interest and excitement.
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