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Copper electrodeposition for nanofabrication of electronics devices [electronic resource]
- 其他作者：
- 其他題名：
- Nanostructure Science and Technology,
- 出版： New York, NY : Springer New York :Imprint: Springer
- 叢書名： Nanostructure Science and Technology,v.171
- 主題： Copper plating. , Chemistry , Electrochemistry , Nanotechnology , Electronics and Microelectronics, Instrumentation. , Solid state physics
- ISBN： 9781461491767 (electronic bk.) 、 9781461491750 (paper)
-
FIND@SFXID:
CGU
- 資料類型: 電子書
-
讀者標籤：
- 系統號： 005115430 | 機讀編目格式
館藏資訊
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
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