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Materials for Information Technology Devices, Interconnects and Packaging / [electronic resource] :
- 作者: Euromat 2003 (2003 : Lausanne, Switzerland)
- 其他作者:
- 出版: London : Springer-Verlag London Limited
- 叢書名: Engineering materials and processes,
- 主題: Microelectronics--Materials--Congresses , Information technology--Congresses , Engineering , Metallic Materials , Ceramics, Glass, Composites, Natural Methods. , Surfaces and Interfaces, Thin Films. , Electronics and Microelectronics, Instrumentation. , Physics and Applied Physics in Engineering. , Solid State Physics and Spectroscopy.
- ISBN: 9781846282355 (electronic bk.) 、 9781852339418 (paper)
- FIND@SFXID: CGU
- 資料類型: 電子書
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讀者標籤:
- 系統號: 005017163 | 機讀編目格式