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Wire bonding in microelectronics : materials, processes, reliability, and yield
- 作者： Harman, George G.
- 其他題名：
- Reliability and yield problems of wire bonding in microelectronics
- Electronic packaging and interconnection series
- 出版： New York : McGraw-Hill
- 版本：2nd ed.
- 叢書名： Electronic packaging and interconnection series
- 主題： Wire bonding (Electronic packaging)--Production control , Electronic packaging--Reliabiligy , Electronic packaging--Defects , Semiconductors--Failure
- ISBN： 0070326193 (recycled, acid-free paper): US$65.00
- 資料類型: 圖書
- 內容註: Includes bibliographical references and index Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989
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讀者標籤：
- 系統號： 005234990 | 機讀編目格式
館藏資訊
The first edition of this work is considered a classic reference in the field. This new edition updates the entire work and adds 100 pages of information covering new materials and techniques such as fine pitch
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