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Ball grid array technology
- 作者： Lau, John H.
- 其他題名：
- Electronic packaging and interconnection series
- 出版： New York : McGraw-Hill
- 叢書名： Electronic packaging and interconnection series
- 主題： Ball grid array technology
- ISBN： 007036608X :: US$75.00
- 資料類型: 圖書
- 課程: 電子封裝概論 ( 機械系 - 蔡明義)
- 內容註: Includes bibliographical references and index
-
讀者標籤：
- 系統號： 005211498 | 機讀編目格式
館藏資訊
A summary of progress in ball grid array (BGA) packaging technology, for professionals in BGA research and development, and for manufacturers researching BGA for their interconnect systems. Discusses economic, design, material, process, and quality issues, and describes techniques for processing substrates, routing PCB, assembling CBGA, PBGA, and TBGA packages, and inspection of BGA PCB assemblies. Includes treatment of BGA industry infrastructure, and an electronic packaging glossary. Contains bandw photos and diagrams. Annotation copyright by Book News, Inc., Portland, OR
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