8
0
0
0
0
Package electrical modeling, thermal modeling, and processing for GaAs wireless applications
- 作者： Monthei, Dean L., 1958-
- 出版： Boston : Kluwer Academic
- 叢書名： Electronic packaging and interconnects series
- 主題： Electronic packaging , Gallium arsenide semiconductors--Design and construction , Wireless communication systems--Equipment and supplies
- ISBN： 9780792383642 (hbk) 、 0792383648 (hbk)
- 資料類型: 圖書
- 內容註: Includes bibliographical references and index.
-
讀者標籤：
- 系統號： 005030016 | 機讀編目格式
館藏資訊
With high volume commercial wireless markets expanding and cost reduction a primary concern, the interest in modeling as a cost- cutting tool has increased. This book reviews the practical aspects of electrical and thermal modeling of analog (microwave) packages--as opposed to digital--and discusses processing techniques for plastic packaged GaAs parts. The author emphasizes low cost industry standard packages, however, the principles translate to other categories of packages. Coverage includes high frequency issues, EM simulators, finite element analysis, computational fluid dynamics, and die attach issues. For IC designers and engineers in the field of wireless packaging. Annotation copyrighted by Book News, Inc., Portland, OR
資料來源：
Google Book
延伸查詢
Google Books
Amazon