Handbook of thin-film deposition processes and techniques principles, methods, equipment and applications / [electronic resource] :

• 其他作者：
  • Seshan, Krishna.
• 其他題名：
  • Materials science and process technology series.
• 出版： Norwich, N.Y. : Noyes Publications/William Andrew Pub.
• 版本：2nd ed.
• 叢書名： Materials science and process technology series. Electronic materials and process technology
• 主題： Thin film devices--Design and construction--Handbooks, manuals, etc. , Thin films--Handbooks, manuals, etc. , Chemical vapor deposition--Handbooks, manuals, etc. , Filmes finos (equipamentos) , TECHNOLOGY & ENGINEERING--Electronics--Solid State. , TECHNOLOGY & ENGINEERING--Electronics--Semiconductors. , Electronic books.
• ISBN： 1591241936 (electronic bk.) 、 9781591241935 (electronic bk.) 、 9780815517788 (electronic bk.) 、 0815517785 (electronic bk.) 、 9780815514428 、 0815514425 、 9780815517764 (electronic bk.) 、 0815517769 (electronic bk.)
• FIND@SFXID: CGU
• 資料類型: 電子書
• 內容註: Includes bibliographical references and index. Foreword: Gordon Moore -- Recent Changes in the Semiconductor Industry -- Deposition Technologies and Applications: Introduction and Overview -- Silicon Epitaxy by Chemical Vapor Deposition -- Chemical Vapor Deposition of Silicon Dioxide Films -- Metal Organic Chemical Vapor Deposition -- Feature Scale Modeling -- The Role of Metrology and Inspection to Semiconductor Processing -- Contamination Control, Defect Detection and Yield Enhancement in Gigabit Manufacturing -- Sputtering and Sputter Deposition -- Laser and Electron Beam Assisted Processing -- Molecular Beam Epitaxy: Equipment and Practice -- Ion Beam Deposition -- Chemical Mechanical Polishing -- Organic Dielectrics in Multilevel Metallization of Integrated Circuits -- Performance, Processing, and Lithography Trends -- Index.
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• 摘要註: The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
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