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Advanced materials for thermal management of electronic packaging [electronic resource]
- 作者: Tong, Xingcun Colin.
- 其他作者:
- 出版: New York, NY : Springer Springer Science+Business Media, LLC
- 叢書名: Springer series in advanced microelectronics ;30
- 主題: Electronic packaging , Materials , Physics , Electronic Circuits and Devices. , Optical and Electronic Materials. , Engineering Thermodynamics, Heat and Mass Transfer. , Electronics and Microelectronics, Instrumentation.
- ISBN: 9781441977595 (electronic bk.) 、 9781441977588 (paper)
- FIND@SFXID: CGU
- 資料類型: 電子書
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讀者標籤:
- 系統號: 005068806 | 機讀編目格式