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Electronic packaging : design, materials, process, and reliability
- 作者： Lau, John H.
- 其他題名：
- Electronic packaging and interconnection series
- 出版： New York : McGraw-Hill
- 叢書名： Electronic packaging and interconnection series
- 主題： Electronic packaging
- ISBN： 0070371350 (hbk.): US$69.00
- 資料類型: 圖書
- 課程: 電子光電構裝特論 ( 機械系博士班 - 蔡明義)
- 內容註: Includes bibliographical references and index
-
讀者標籤：
- 系統號： 005227998 | 機讀編目格式
館藏資訊
Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.
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