Semiconductor advanced packaging [electronic resource]

• 作者： Lau, John H.
• 其他作者：
  • SpringerLink (Online service)
• 出版： Singapore : Springer Singapore :Imprint: Springer
• 主題： Semiconductors--Design and construction. , Electronics and Microelectronics, Instrumentation. , Semiconductors. , Industrial and Production Engineering.
• ISBN： 9789811613760 (electronic bk.) 、 9789811613753 (paper)
• FIND@SFXID: CGU
• 資料類型: 電子書
• 內容註: Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging.
• More
• 摘要註: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
• 讀者標籤：

  需登入
• 引用連結：

  Copy Link
• 目前引用數
• Share: